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TB62709NG/FG
TOSHIBA Bi-CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62709NG,TB62709FG
7-SEGMENT DRIVERS WITH BUILT-IN DECODERS (COMMON ANODE CAPABILITY, MAXIMUM 4-DIGIT CONTROL)
The TB62709NG and TB62709FG are multifunctional, compact, 7-segment LED display drivers. These ICs can directly drive 7-segment displays and individual LEDs, and can control either a 4-digit display with decimal points, or 32 individual LEDs. These ICs can also be used with common-anode displays. Their outputs are constant current, the ampere levels at which are set using an external resistor. A synchronous serial port connects the IC to the CPU. The different modes of control provided by this device including Duty Control Register Set, Digit Set, Decode Set and Standby Set, are all based on every 16-bit of serial data. The suffix (G) appended to the part number represents a Lead(Pb)-Free product.
TB62709NG
TB62709FG
FEATURES
Control circuit power supply : VDD = 4.5 to 5.5 V Digit output rating : 17 V / -400 mA Decoder output rating : 17 V / 50 mA Built-in decoder : Decodes the numerals 0 to 9, certain alphabetic characters, and of course blanks code. Digit control function : Can scan digit outputs DIG-0 to DIG-3 when connected to the common anode pins of a 7-segment display. Maximum transmission frequency : fCLK = 15 MHz Decoder outputs (OUT-A to OUT-Dp) Output current can be set up to a 40mA maximum using an external resistor. Constant current tolerance (Ta = 25C, VDD = 5.0 V) : Variation between bits = 7%, variation between devices (including variation between bits) = 15% at VCE 0.7 V Package : 24-pin SDIP (SDIP24-P-300-1.78) 24-pin SSOP (SSOP24-P-300-1.00) Weight SDIP24-P-300-1.78 : 1.62 g (typ.) SSOP24-P-300-1.00 : 0.32 g (typ.)
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PIN ASSIGNMENT (Top view)
BLOCK DIAGRAM
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PIN FUNCTIONS
PIN NUMBER 1 2 3 PIN NAME VDD DATA-IN (DI) CLOCK (CK) 5 V power pin. Serial data input pin. Clock input pin. The shift register shifts data on the clock's rising edge. Load signal input pin. The data in the D8 to D15 are read on the rising edge and the current load register the is selected from among the Duty Register, the Decode & Digit Register, or Data Registers 0 to 3. The D0 to D7 bits of the 16-bit shift register contain data corresponding to the same registers just described, which are read on the load signal's falling edge. Segment drive output pins. The A to Dp outputs correspond to the seven segments. These pins output constant sink current. Connect each of these pins to the corresponding LED's cathode. Ground pins, There are two which can be used to ground the output OUT-A to OUT-Dp pins. Product test pin. In normal use, be sure to connect to ground. Product test pin. In normal use, be sure to connect to ground. Digit output pins. Each of these pins can control one of the four seven-segment digits in a display. These pins output the VCC pin voltage as a source current output. Connect these pins to the LED anodes. Power pin for digit output. Current setting pin for the OUT-A to OUT-Dp pins. Connect a resistor between this pin and ground when setting the current. Serial data output pin. Use when TB62709NG or TB62709FG devices are used in cascade connections. Ground pin for logic and analog circuits. FUNCTION
4
LOAD (LD)
5~12 13, 21 14 15
OUT-A to OUT-Dp P-GND TEST-IN2 TEST-IN1
16, 17, 19, 20
DIG-0 to DIG-3
18 22 23 24
VCC R-EXT DATA-OUT (DO) L-GND
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TIMING DIAGRAM
DATA INPUT
Transfer data to the DATA-IN pin on every 16-bit combining address (8bits) and data (8bits). After the 16th clock signal input following this data transfer input a load signal from the LD pin. Input the load signal using an Active High pulse. The register address is set on the rising edge of the load pulse. On the subsequent falling edge, the data are read as data of the mode of the register.
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DESCRIPTION OF OPERATION
Data input (DATA-IN, CLOCK, LOAD) The data are input serially using the DATA-IN pin. The data input interface consists of a total of three inputs : DATA-IN, LOAD, and CLOCK. Binary code stored in the 16-bit shift register offers control modes including duty Control Register Set, Digitset, Decode Set, and Standby Set, The data are shifted on the rising edge of the clock, starting from the MSB. Cascade-connecting TB62709NG or TB62709FG devices provides capability for controlling a larger number of digits. The serial data in the 16-bit shift register are used as follows : the four bits D15 (MSB) to D12 select the IC operating mode (Table 1), while D11 to D8 select the register corresponding to the operating mode (Table 2). Bits D7 to D0 (LSB) of the 16-bit shift register are used for detail settings, such as number of digits in use, character settings in each digit, and light intensity. The internal registers are loaded on the rising edge of the LOAD signal, which causes loading of data from an external source into the D15 (MSB) to D8 bits of the shift register, operating mode and the corresponding register selection data. On the subsequent falling edge, the detail setting data of D7 to D0 (LSB) are loaded. Normally LOAD is Low. After a serial transfer of 16bits, the input of a High-level pulse loads the data. Note the following caution : Use the D15 to D8 setting and the D7 to D0 detail data setting as a pair. If only the D7 to D0 data are input without setting D15 to D8 an error condition may result, in which the device will not operate normally. If the current mode is set again by a new signal, the data for D15 to D8 must also be re-input. Operating precautions At power-on or after operation in Clear mode (in initial state), set the IC to Normal mode again. Otherwise, the IC will not drive the LED. Operating the IC in Blank mode (all lights off) or in All On mode (all lights lit) does not affect the internal data. Setting the IC to Normal mode again continues the LED lighting in the state governed by the settings made immediately before mode change. Normal mode (not Shut Down, Clear, Blank, or All On mode) continues the operations set in Load Register mode. In Normal mode, operations are governed by any new settings made in the Load Register, as soon as the changed setting values are loaded.
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Operating modes (Table 1.) These ICs support the following five operating modes : 1. Blank : Forcibly turns OFF the constant-current output both for data and for digit setting. This mode is not affected by the values in bits D11 to D0. 2. Normal Operate : Used for display operations after the settings of the digits are complete. Note that setting this mode without making any other settings will cause display of the numeral 0. 3. Load Register : Used for the detail settings of the Duty Control Register, for setting Decode / No Decode, for inputting display data, and for setting the number of digits to drive. D11 to D0 of the shift register are used for the detail settings of the digits currently being driven (Table 2). : Forcibly turns ON the data-side constant-current output. This mode is not affected by D11 to D0. The initial setting is four digits. When the digits must be changed, use Load Register mode to set the number of digits to drive. : Used to set Standby state (in which internal data are not cleared) and to clear data (initialization). The settings in D3 to D0 of the shift register determine the choice between standby state or initialization.
4. All On
5. Standby
Table 1 Operating mode settings
D15 BLANK (OUT-n & DIG-0~3 ALL-OFF) NORMAL (OPERATION) LOAD REGISTER (DUTY, DECODE, DIGIT & DATA) ALL ON (OUTn ALL-ON) STAND-BY 0 0 0 0 0 D14 0 0 0 0 1 D13 0 0 1 1 0 REGISTER DATA D12 D11~D8 D7~D4 0 1 0 1 0 X X D3~D0 X X HEX CODE 0---H 1---H 2XXXH 3---H 4--XH INITIAL SETTING
X = Input H or L. "-" = Are not affected by the truth table.
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Load Register Selection modes (Table 2) These modes select the register to provide the data to control the IC operation. The Load Register selection mode is determined by the settings of D15 to D12 and D11 to D8 of the shift register. 1. Duty Register : The data in D7 to D0 of this register set the digit output duty cycle. Duty settings can be made in 16 steps from 0 / 16 to 15 / 16. (See Table 3)
2. Decode & Digit Register : Sets Decode / No Decode and the number of digits to drive. Decode can be set using D7 to D4. The number of digits driven can be set using D3 to D0. Decode / No Decode and the number of digits driven are set simultaneously. 3. Data registers 0 to 3 : Set the display data corresponding to DIG0 to DIG3 respectively. D7 to D0 of the shift register are used to set the display data.
Table 2 Load register selection
REGISTER DATA D15~D12 LOAD DUTY REGISTER LOAD DECODE & DIGIT REGISTER LOAD DATA REGISTER 0 LOAD DATA REGISTER 1 LOAD DATA REGISTER 2 LOAD DATA REGISTER 3 2H 2H 2H 2H 2H 2H D11 0 0 0 0 0 0 D10 0 0 0 0 1 1 D9 0 0 1 1 0 0 D8 0 1 0 1 0 1 D7~D4 X X X X X X D3~D0 X X X X X X HEX CODE 20XXH 21XXH 22XXH 23XXH 24XXH 25XXH
X = Input H or L.
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DUTY CONTROL REGISTER SETTINGS
Duty Control Register detail settings and operation (Table 3) Writing 20H to D15~D8 and writing 0~FH to D3~D0 sets the duty cycle shown in the following table for the digit-side source driver output. The duty cycle can be set in 16 steps. The initial setting is 15 / 16. After Data Clear, the setting is also 15 / 16. The current settings continue until changed (by reset execution, or to the initial state, Data Clear state, or standby state).
Table 3 Duty control register settings
DUTY CYCLE 0 / 16 1 / 16 2 / 16 3 / 16 4 / 16 5 / 16 6 / 16 7 / 16 8 / 16 9 / 16 10 / 16 11 / 16 12 / 16 13 / 16 14 / 16 15 / 16 REGISTER DATA D15~D8 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H 20H D7~D4 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 HEX CODE 20X0H 20X1H 20X2H 20X3H 20X4H 20X5H 20X6H 20X7H 20X8H 20X9H 20XAH 20XBH 20XCH 20XDH 20XEH 20XFH INITIAL SETTING
X = Input H or L. "-" = Are not affected by the truth table.
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DIGIT SETTINGS
Setting the number of digits (Table 4) Writing 21H to D15~D8 and at the same step writing 0H~3H to D3~D0 sets the number of digits to a maximum of four the display. The initial setting is four digits, and four will also be set by a Data Clear. The current settings continue until changed (by reset execution, or to the initial state, Data Clear state, or standby state). When changing the number of digits, also set D7 to D4.
Table 4
D15~D8 ACTIVATED DIG--0 ONLY ACTIVATED DIG--0~1 ACTIVATED DIG--0~2 ACTIVATED DIG--0~3 21H 21H 21H 21H D7~D4 X X X X D3 0 0 0 0
Digit settings
REGISTER DATA D2 D1 0 0 0 0 0 0 1 1 D0 0 1 0 1 HEX CODE 21X0H 21X1H 21X2H 21X3H INITIAL SETTING
X = Input H or L.
DECODE SETTINGS
Decode settings (Table 5) The settings for Decode are the same as the settings for the number of digits, described under setting, above. Writing 21H to D15~D8 and writing 0~1H to D7~D4 set Decode mode. When using this IC for controlling the lighting on individual LEDs used for a dot matrix rather than a 7-segment display, set to No Decode. As Table 6 shows, D0 in the data register is used to turn OUT-a ON and OFF ; D1 turns OUT-b ON and OFF. The initial setting is Decode mode, and Decode mode will also be set by a Data Clear. The current settings continue until changed (by reset execution, or to the initial state, Data Clear state, or standby state). Since D3 to D0 are also used for setting the number of digits, when changing the Decode setting, also set D3 to D0.
Table 5
D15~D8 PASS DECODER (NO DECODE) DECODE 21H 21H D7 0 0
Decode settings
D6 0 0 REGISTER DATA D5 D4 0 0 0 1 D3~D0 X X HEX CODE 210XH 211XH INITIAL SETTING
X = Input H or L.
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THE FOLLOWING TABLE SHOWS THE CORRESPONDENCE BETWEEN THE SERIAL DATA AND THE OUTPUT PINS WHEN NO DECODE IS SET Table 6 Correspondence between serial data and output pins in no decode mode
REGISTER DATA D0 D1 D2 D3 D4 D5 D6 D7 OUTPUT OUT-a OUT-b OUT-c OUT-d OUT-e OUT-f OUT-g OUT-Dp INITIAL STATE L L L L L L L L Output is ON when data = H and OFF when data = L. NOTE
STANDBY SETTINGS
Standby mode settings and operation (Table 7) Writing 4H to D15~D12 and writing 0H to D3~D0 sets Standby mode. Writing 4H to D15~D12 and writing 1H to D3~D0 sets All Data Clear mode. Standby mode maintains the settings made immediately before this mode came in force, turns the output current OFF, and controls the bias current flowing in the internal circuits. All Data Clear resets all settings to their initial states.
Table 7 Standby settings
D15~D8 STANDBY (NO DATA CLEAR) ALL DATA CLEAR 4-H 4-H D7~D4 D3 0 0 REGISTER DATA D2 D1 0 0 0 0 D0 0 1 HEX CODE 4XX0H 4XX1H
X = Input H or L. "-" Are not affected by the truth table.
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LIST OF CHARACTER GENERATOR DECODING DATA
Character generator decoding (Table 8) As the following table shows, the characters are decoded using combinations of the data in D0 to D3 and D5 to D4. In decoding, D6 is used exclusively for setting decimal points. Spaces where (D0, D1, D2, D3) = (0000) and (D5, D4) = (01) are regarded as blank.
Table 8 List of character generator decoding data
D0 D1 D2 D3 D5 0 0 D4 0 1 HEX 0 1 0 0 0 0 0 1 0 0 0 1 0 1 0 0 2 1 1 0 0 3 0 0 1 0 4 1 0 1 0 5 0 1 1 0 6 1 1 1 0 7 0 0 0 1 8 1 0 0 1 9 0 1 0 1 A 1 1 0 1 B 0 0 1 1 C 1 0 1 1 D 0 1 1 1 E 1 1 1 1 F
D7 X X
D6 0 1 Dp OFF Dp ON
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DATA INPUT
(Example 1: Displays and blinks characters a, b, c and d in digits 0, 1, 2 and 3 respectively. Period after "d" part of it, or a sentence-end marker?)
STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 D15~ D12 0010 0010 0010 0010 0010 0010 0001 0010 0000 0001 0000 0001 0000 0001 0100 D11~ D8 0000 0001 0010 0011 0100 0101 XXXX 0000 XXXX XXXX XXXX XXXX XXXX XXXX XXXX D7~ D4 XXXX 0001 X000 X000 X000 X000 XXXX XXXX XXXX XXXX XXXX XXXX XXXX XXXX XXXX D3~ D0 1111 0011 1010 1011 1100 1101 XXXX 1000 XXXX XXXX XXXX XXXX XXXX XXXX 0000 DIG -0~3 OFF OFF OFF OFF OFF OFF OFF ON ON OFF ON OFF ON OFF ON OFF SEG -a, b, c, d, e, f, g OFF OFF OFF OFF OFF OFF OFF ON ON OFF ON OFF ON OFF ON OFF SEG -Dp OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF MODE At power-on ( = CLEAR MODE) DUTY = 15 / 16 DECODE, 4DIG DIG-0 = a DIG-1 = b DIG-2 = c DIG-3 = d NORMAL DUTY = 8 / 16 BLANK NORMAL BLANK NORMAL BLANK NORMAL STAND-BY (SHUT DOWN) DISPLAY INDICATE ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK a-b-c-d a-b-c-d ALL BLANK a-b-c-d ALL BLANK a-b-c-d ALL BLANK a-b-c-d ALL BLANK
DATA INPUT
(Example 2: Scroll-lights digits 0, 1, 2, 3 = a., -b., -c., -d. ?SEQ; and please explain the data on rhs? digit by digit (with decimal points))
STEP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 D15~ D12 0010 0010 0010 0010 0010 0010 0001 0010 0010 0010 0010 0010 0010 0100 D11~D 8 0000 0001 0010 0011 0100 0101 XXXX 0010 0011 0011 0100 0100 0101 XXXX D7~ D4 XXXX 0001 X100 X001 X001 X001 XXXX X001 X100 X001 X100 X001 X100 XXXX D3~ D0 1111 0011 1010 0000 0000 0000 XXXX 0000 1011 0000 1100 0000 1101 0000 DIG -0~3 OFF OFF OFF OFF OFF OFF OFF ON OFF ON OFF ON OFF ON OFF SEG -a, b, c, d, e, f, g OFF OFF OFF OFF OFF OFF OFF ON ON ON ON ON ON ON OFF SEG -Dp OFF OFF OFF OFF OFF OFF OFF ON OFF ON OFF ON OFF ON OFF MODE At power-on ( = CLEAR MODE) DUTY = 15 / 16 DECODE, 4DIG DIG-0 = a. DIG-1 = blank DIG-2 = blank DIG-3 = blank NORMAL DIG-0 = blank DIG-1 = b. DIG-1 = blank DIG-2 = c. DIG-2 = blank DIG-3 = d. STAND-BY (SHUT DOWN) DISPLAY INDICATE ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK ALL BLANK a.--- ALL BLANK -b.-- ALL BLANK --c.- ALL BLANK ---d. ALL BLANK
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STATE TRANSITION DIAGRAM
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ABSOLUTE MAXIMUM RATINGS (Ta = 25C)
CHARACTERISTIC Supply Voltage for Logic Circuits Supply Voltage DIG-0 to DIG-3 Output Current OUT-a to Dp Output Current Output Current for Logic Block Input Voltage Operating Frequency Total Supply Current Power Dissipation TB62709NG TB62709FG SYMBOL VDD VCC IDIG IOUT IOH / IOL VIN fCK IVDD PD Topr Tstg RATING 7.0 17 -400 50 5 -0.3~VDD + 0.3 15.0 400 1.78 0.62 -40~85 -55~150 UNIT V V mA mA mA V MHz mA W C C
Operating Temperature Storage Temperature
ELECTRICAL CHARACTERISTICS
(Unless otherwise stated, VDD = 5.0 V, VCC = 5.0 V, REXT = 760 , Ta = -40~85C)
CHARACTERISTIC SYMBOL TEST CIR- CUIT 1 TEST CONDITION SET NORMAL OPE. MODE, REXT = 760 @OUT-a~Dp ALL ON, Ta = 25C SET NORMAL OPE. MODE, REXT = 760 @OUT-a~Dp ALL ON VCC = 12 V, Ta = 25C NORMAL OPE. MODE, VDD = 4.5~5.5 V NORMAL OPE. MODE, VCE = 0.7 V, REXT = 760 ALL OFF MODE, VCC = 17 V ALL OFF MODE, VCC = 17 V NORMAL OPE. MODE, IDIG = -320 mA MIN TYP. MAX UNIT
ICC1 Operating Power Supply Current for Output Block ICC2 DIG-0 to DIG-3 Scan Frequency OUT-a to Dp Output Sink Current DIG-0 to 3 Output Leakage Current OUT-a to Dp Output Leakage Current DIG-0 to 3 Output Voltage fOSC ISEG Ileak1 Ileak2 VOUT
300
mA
1
320
2 3 4 4 5
240 29 3.0
480 34
960 40 -20 20
Hz mA A A V
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Logic block
CHARACTERISTIC Static Power Supply Current for Logic Circuits Operating Power Supply Current for Logic Circuits High Input Current for Logic Circuits Low Input Current for Logic Circuits High Output Voltage for Logic Circuits Low Output Voltage for Logic Circuits Clock Frequency SYMBOL IDD1 IDD2 IDD3 TEST CIR- CUIT 6 6 TEST CONDITION STANDBY MODE, Ta = 25C BLANK MODE, Ta = 25C NORMAL OPE. MODE, fCLK = 10MHz, DATA-IN : OUT-a~Dp = ON, Ta = 25C DATA-IN, LOAD & CLOCK : VIN = 5 V DATA-IN, LOAD & CLOCK : VIN = 0 V DATA-OUT, IOH = -1.0 mA DATA-OUT, IOH = -1.0 A DATA-OUT, IOL = 1.0 mA DATA-OUT, IOH = 1.0 A CASCADE CONNECTED, Ta = -40~85C MIN TYP. MAX 200 12.5 UNIT A mA
6
20.5
mA
IIH IIL VOH1 VOH2 VOL1 VOL2 fCLK
6 6 6 6 6
4.6 10
VDD 0.1
1 -1 0.4
A A V
V MHz
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SWITCHING CHARACTERISTICS
(Unless otherwise stated, VDD = 5.0 V, VCC = 5.0 V, Ta = 25C)
CHARACTERISTIC Data Hold Time (D-IN-CLOCK) Data Setup Time (D-IN-CLOCK) Serial Output Delay Time (CLOCK-D-OUT) High Clock Pulse Width Low Clock Pulse Width Load Pulse Width Load Clock Time (CLOCK-LOAD) Clock Load Time (LOAD-CLOCK) OUT-a to Dp Output Delay Time (LOAD-OUTn) OUT-a to Dp Output Rise Time (OUTn) OUT-a to Dp Output Fall Time (OUTn) DIG-0~DIG-3 Output Delay Time (LOAD-DIGn) DIG-0~DIG-3 Output Rise Time (DIGn) DIG-0~DIG-3 Output Fall Time (DIGn) SYMBOL tDHO tDST tpHL-SO tpLH-SO tCKH tCKL twLD tCLK-LD tLD-CLK tpHL-SEG tpLH-SEG tr SEG tf SEG tpHL-DIG tpLH-DIG tr DIG tf DIG TEST CIR- CUIT CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF CL = 10 pF TEST CONDITION MIN 0.2 0.2 0.4 0.4 TYP. 10 20 25 25 30 30 100 50 50 1.0 1.0 2.0 2.0 MAX 5.0 5.0 10.0 10.0 UNIT ns ns ns ns ns ns ns ns s s s s s s
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RECOMMENDED OPERATING CONDITIONS
TEST CIR- CUIT VOUT = 3.0 V VCE = 0.7 V
(Unless otherwise stated, VDD = 5.0 V, VCC = 5.0 V, Ta = -40~85C)
CHARACTERISTIC Supply Voltage for Output Block DIG-0 to DIG-3 Output Source Current OUT-a to OUT-Dp Output Sink Current SYMBOL VCC IDIG ISEG TEST CONDITION MIN 4.0 TYP. MAX 6.0 -320 40 UNIT V mA mA
Logic block
CHARACTERISTIC Supply Voltage for Logic Block High Input Current for Logic Circuits Low Input Current for Logic Circuits High Input Voltage for Logic Circuits Low Input Voltage for Logic Circuits SYMBOL VDD IIH IIL VIH VIL TEST CIR- CUIT TEST CONDITION DATA-IN, LOAD & CLOCK, VIN = VDD DATA-IN, LOAD & CLOCK, VIN = 0V MIN 4.5 0.7 VDD TYP. MAX 5.5 1 -1 0.3 VDD UNIT V A A V V
SWITCHING CONDITIONS
CHARACTERISTIC Data Hold Time (D-IN-CLOCK) Data Setup Time (D-IN-CLOCK) Serial Output Delay Time (CLOCK-D-OUT) High Clock Pulse Width Low Clock Pulse Width Load Pulse Width Load Clock Time (CLOCK-LOAD) Clock Load Time (LOAD-CLOCK) SYMBOL tDHO tDST tPDSO tCKH tCKL twLD tCLKLD tLDCLK TEST CIR- CUIT CL = 10 pF TEST CONDITION MIN 30 50 50 30 30 150 100 100 TYP. MAX UNIT ns ns ns ns ns ns ns ns
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TEST CIRCUITS
(1) ICC1, ICC2
(2) fOSC
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(3) ISEG
(4) Ileak1, Ileak2
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(5) VOUT
(6) IDD1, IDD2, IDD3, VOH1, VOH2, VOL1, VOL2, fCLK
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DUTY CYCLE SETTINGS AND OUTPUT CURRENT VALUES
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EXTERNAL RESISTANCE AND OUTPUT CURRENT VALUES
The following diagram shows application circuits. Because operation may be unstable due to influences such as the electromagnetic induction of the wiring, the IC should be located as close as possible to the LED. The L-GND and P-GND of the IC are connected to the substrate in the IC. Take care to avoid a potential difference exceeding 0.4V at two pins. When executing the pattern layout, Toshiba recommends not including inductance components in the GND or output pin lines, and not inserting capacitance components exceeding 50pF between the REXT and GND.
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APPLICATION CIRCUIT EXAMPLE (Connection example)
PRECAUTIONS for USING
Utmost care is necessary in the design of the output line, VCC (VDD) and (L-GND, P-GND) line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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Package Dimensions
Weight: 1.62 g (typ.)
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Package Dimensions
Weight: 0.32 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
(2)
(3)
(4)
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(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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2006-06-14
TB62709NG/FG
About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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2006-06-14

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